An improved PCB via was designed and fabricated, boasting higher insolation between traces, greater frequency invariance and tailored characteristic impedance.
This improved PCB via or ‘Sleeved Coaxial Printed Circuit Board Via’ uses a novel patented PCB processing method for fabrication. As a result neighboring signal transmissions are isolated from each other. Undesirable reflections and EM transmission interference from neighboring signal paths are mitigated or terminated.
This novel process was designed to be implemented using standard PCB fabrication techniques. The Sleeved Coaxial Printed Circuit Board Via is compatible with all basic traces; i.e. co-planar waveguide, microstrip and stripline.
In addition the resulting high EM suppression between neighboring signal paths permits close proximity of power and signal path shared real-estate. The single outer metal sleeve reduces shorting via count with reduced impedance inaccuracies and a more direct signal return path.