Embedded Hard-Stop Interconnect Spacers for 3D/Flip-Chip Integrated Superconducting Qubit Module
Invention type: Technology
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Case number: #26145L
Researchers
Departments: Dept of Electrical Engineering & Computer Science, Lincoln Laboratory
Technology Areas: Chemicals & Materials: Nanotechnology & Nanomaterials / Electronics & Photonics: Quantum Technology, Semiconductors / Industrial Engineering & Automation: Manufacturing & Equipment
Impact Areas: Connected World
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embedded hard-stop interconnect spacers for 3d/flip-chip integrated superconducting qubit module
United States of America | Pending -
embedded hard-stop interconnect spacers for 3d/flip-chip integrated superconducting qubit module
United States of America | Pending
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