Rabindra Das

LL - Technical Staff
Department
Lincoln Laboratory
Technology Areas
Electronics & Photonics: Semiconductors / Computer Science: Quantum Computing, Networking & Signals / Artificial Intelligence (AI) and Machine Learning (ML) / Chemicals & Materials: Fabrics & Textiles, Nanotechnology & Nanomaterials
Impact Areas
Connected World, Advanced Materials, Uncharted Frontiers

Technologies

Design Interconnects for Finer Pitch Assembly Suitable for Commercial and Military Applications

Technology / Case number: #16918L
Timothy Hancock / Rabindra Das / Peter Murphy / Karen Harmon / Noyan Kinayman / Michael Barbieri / Mark Gouker
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

Miniaturized 3DIC Integrated Package

Technology / Case number: #17313L
Steven Vitale / Rabindra Das / Donna-Ruth Yost / Chenson Chen / Craig Keast / Mark Gouker / Keith Warner
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

Active Wafer-Scale Reconfigurable Logic Fabric for AI and High-Performance Embedded Computing

Technology / Case number: #24171L
Albert Reuther / Rabindra Das / Vitaliy Gleyzer / Brian Tyrrell
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Chemicals & Materials / Computer Science
Impact Areas: Advanced Materials
License

Extremely Large Area Integrated Circuits (ICs)

Technology / Case number: #23779L
Rabindra Das / Kenneth Schultz / Brian Tyrrell
Technology Areas: Computer Science / Electronics & Photonics
Impact Areas: Connected World
License

3D Cryogenic Packaging for Superconducting Computing

Technology / Case number: #19039L
Eric Dauler / Rabindra Das
Technology Areas: Electronics & Photonics
Impact Areas: Uncharted Frontiers
License

Structures, Compositions and Fabrications of Microbump Based Interconnect Technology for High Density Packaging

Technology / Case number: #17465L
Leonard Johnson / Pascale Gouker / Rabindra Das / Ryan Johnson / Mark Gouker
Technology Areas: Electronics & Photonics
Impact Areas: Connected World, Advanced Materials
License

Novel Technique for Increasing Efficiency of 3DIC Fabrication

Technology / Case number: #18705L
Rabindra Das
Technology Areas: Electronics & Photonics
Impact Areas: Advanced Materials
License

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