Extremely Large Area Integrated Circuits (ICs)

A highly secure circuit architecture is built by arranging hundreds of tightly packed chips, allowing it to meet the growing size and performance needs of modern microelectronic systems.

Departments: Lincoln Laboratory
Technology Areas: Computer Science: Networking & Signals / Electronics & Photonics: Semiconductors
Impact Areas: Connected World

  • extremely large area integrated circuit
    United States of America | Pending

By using a novel heterogeneous chip-tiling architecture, extremely large-area integrated circuits (ELAICs) can be built from hundreds of tightly packed chiplets—small, high-performance chips manufactured with cutting-edge 5 nm, 7 nm, or 10 nm lithography. This approach not only delivers enhanced security, but also unlocks unprecedented scale and performance to meet the escalating demands of modern microelectronics in mobile devices, advanced sensing platforms, high-performance computing, and sectors like automotive, healthcare, and aerospace.

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