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Universal-Pitch Self-aligning Photonic Interconnect Cable (USPIC) for Photonic Integrated Circuits

Technology / Case number: #22410
Dirk R Englund / Saumil Bandyopadhyay
Technology Areas: Chemicals & Materials / Electronics & Photonics / Industrial Engineering & Automation
Impact Areas: Connected World, Advanced Materials
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Spectrally Multiplexed Solid State Quantum Emitters and Memories for Quantum Repeaters

Technology / Case number: #22414
Dirk R Englund / Carlos Errando Herranz / Eric Bersin
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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PnuGrip: An Active Two-Phase Gripper for Dexterous Manipulation

Technology / Case number: #22455
Nikhil Chavan Dafle / Ian Taylor / Neel Doshi / Alberto Rodriguez
Technology Areas: Industrial Engineering & Automation
Impact Areas: Sustainable Future
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In-Situ Real-Time Material Property Testing for Additive Manufacturing

Technology / Case number: #22492
C. Cem Tasan / Gianluca Roscioli
Technology Areas: Industrial Engineering & Automation
Impact Areas: Connected World
Labels
  • Additive Manufacturing
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Elastic Strain Engineering of Diamond Bandgap and Diamond Metallization

Technology / Case number: #22724J
Subra Suresh / Zhe Shi / Ju Li / Ming Dao
Technology Areas: Computer Science / Electronics & Photonics / Industrial Engineering & Automation
Impact Areas: Sustainable Future, Advanced Materials
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NetCast: Low-Power Edge Computing with Optical Neural Networks via WDM Weight Broadcasting

Technology / Case number: #22737J
Dirk R Englund / Ryan Hamerly
Technology Areas: Biotechnology / Computer Science / Sensing & Imaging
Impact Areas: Healthy Living
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CubeSat Robotic Assembly

Technology / Case number: #22738
Kerri Cahoy / Ezinne Uzo-Okoro
Technology Areas: Industrial Engineering & Automation
Impact Areas: Sustainable Future, Connected World
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Distributed Sensor Array Quench Detection Method for Superconducting Devices

Technology / Case number: #22766
Makoto Takayasu
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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Optically-Heralded Entanglement of Superconducting Systems in Quantum Networks

Technology / Case number: #22977
Dirk R Englund / Hamza Raniwala / Stefan Krastanov
Technology Areas: Computer Science / Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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Field Management Structures for Vertical GaN Power Devices

Technology / Case number: #23037
Tomas Palacios / John Niroula / Ahmad Zubair
Technology Areas: Electronics & Photonics / Industrial Engineering & Automation
Impact Areas: Advanced Materials
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Integrated Optical Field Sampling Platform

Technology / Case number: #22691J
Franz Kaertner / Felix Ritzkowsky / Dario Cattozzo Mor / Phillip Donald Keathley / Mina Bionta / Marco Turchetti / Yujia Yang / William Putnam / Karl Berggren
Technology Areas: Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Connected World
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Printable Programmable Machines: Origami Inspired Planar Fabrication of Three-Dimensional Systems

Technology / Case number: #15684J
Daniela Rus / Michael Tolley / Cagdas Onal / Robert Wood
Technology Areas: Industrial Engineering & Automation
Impact Areas: Advanced Materials
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Closed-Loop Ingestible Robot for Radiation and Chemical Sensing

Technology / Case number: #22735
Giovanni Traverso / James Byrne / Hen Wei Huang
Technology Areas: Biomaterials & Bioelectronics / Biotechnology / Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Healthy Living, Uncharted Frontiers
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Ultra-high Efficiency Alcohol Engines Using Optimized Exhaust Heat Recovery

Technology / Case number: #15733K
Daniel Cohn / Leslie Bromberg
Technology Areas: Energy & Distribution / Industrial Engineering & Automation
Impact Areas: Sustainable Future
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Contact-Independent and High-Resistance Measurement of Electrical Conductance of a Thin Solid Film with a Nanoscale Sensor

Technology / Case number: #14921
Marc A Kastner / Nirat Ray / Kenneth MacLean / Tamar Mentzel
Technology Areas: Chemicals & Materials / Sensing & Imaging
Impact Areas: Advanced Materials
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Wireless Interlaminar Sensor (WINS): CNT Delamination Sensor with Environmental Compensation

Technology / Case number: #23855J
Brian L Wardle / Haim Primo / Haozhe Wang / Yosef (Yosi) Stein / Luiz Henrique Acauan
Technology Areas: Chemicals & Materials / Communication Systems / Sensing & Imaging
Impact Areas: Advanced Materials
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Pupil Engineering Method to Enhance the Signal of the Real-time non-invasive Particle Size Distribution Probe in Powders and During Mixing, Drying, Blending, and Milling Processes

Technology / Case number: #24521
George Barbastathis / Ajinkya Pandit / Zhen Guo / Qihang Zhang / Richard D Braatz / Allan S. Myerson
Technology Areas: Chemicals & Materials / Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Advanced Materials
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Low-Temperature Synthesis of Two-Dimensional Materials

Technology / Case number: #24560
Jing Kong / Ji Hoon Park / Jiadi Zhu / Jiangtao Wang / Tomas Palacios
Technology Areas: Chemicals & Materials / Electronics & Photonics / Energy & Distribution / Industrial Engineering & Automation
Impact Areas: Advanced Materials
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High-Temperature Miniature Ultrasonic Probes

Technology / Case number: #24612
Hoagy O'Ghaffari / Matej Pec
Technology Areas: Sensing & Imaging
Impact Areas: Advanced Materials
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Device and Method for Imaging Shortwave Infrared Autofluorescence

Technology / Case number: #18527J
Moungi G Bawendi / Marianne Aellen / Yi Zheng / Klaus Van Leyen / Jessica Carr / Oliver Bruns
Technology Areas: Diagnostics / Sensing & Imaging
Impact Areas: Healthy Living
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The technologies listed represent a selection of the MIT intellectual property protected by the TLO.

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