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A Method of Sensorizing Soft Architected Materials by Embedding Fluidic Channels

Technology / Case number: #23908
Daniela Rus / Annan Zhang / Ryan Truby / Lillian Chin
Technology Areas: Chemicals & Materials / Sensing & Imaging
Impact Areas: Connected World, Advanced Materials
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A Method to Extract Physical Behavior Directly from Simple Visual Empirical Observation Via a Deep Learning Model, for a Material Agnostic Approach to Predicting Compressive Beam Buckling

Technology / Case number: #24061
Markus J. Buehler / Andrew Lew
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Connected World, Advanced Materials
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ZZ Amplification Using A Fluxonium Coupler With A Large ON/OFF Ratio

Technology / Case number: #24096
William Oliver / Junyoung An / Leon Ding / Roni Winik / Simon Gustavsson / Youngkyu Sung
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Connected World, Advanced Materials
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Methods and Apparatuses to Generate Fock and Sub-Poissonian States through Nonlinear Optics

Technology / Case number: #24710
Marin Soljacic / Yannick Salamin / Jamison Sloan / Nicholas Rivera
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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A Real-Time Motion Planning and Obstacle Avoidance System for a Physical Robot Operating in Close Proximity to a Human

Technology / Case number: #24886
Julie Shah / Christopher Fourie / Nadia Barbara Figueroa Fernandez
Technology Areas: Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Advanced Materials
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Optically Controlled Semiconductor Power Devices

Technology / Case number: #25122
Tomas Palacios / Jung-Han Hsia
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Sustainable Future, Advanced Materials
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Complete Condensation Of Photon Noise In Nonlinear Dissipative Systems

Technology / Case number: #24094
Marin Soljacic / Yannick Salamin / Jamison Sloan / Nicholas Rivera
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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Freely Scalable Quantum Computing using a 2D Atomic Emitter Array with Massively Parallel Optical Interconnects

Technology / Case number: #21670
Dirk R Englund / Hyeongrak Choi
Technology Areas: Computer Science / Electronics & Photonics / Sensing & Imaging
Impact Areas: Uncharted Frontiers, Advanced Materials
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All-to-All Coupled Quantum Computing with Atomic Ensembles in an Optical Cavity

Technology / Case number: #22158J
Vladan Vuletic / Misha Lukin / Zachary Vendeiro / Joshua Ramette
Technology Areas: Computer Science / Sensing & Imaging
Impact Areas: Advanced Materials
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Optical Devices based on Phase Change Materials

Technology / Case number: #22247
Juejun Hu / Xiaoming Qiu / Mikhail Shalaginov / Carlos Andres Rios Ocampo / Yifei Zhang / Tian Gu
Technology Areas: Chemicals & Materials / Sensing & Imaging
Impact Areas: Advanced Materials
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Spectrally Multiplexed Solid State Quantum Emitters and Memories for Quantum Repeaters

Technology / Case number: #22414
Dirk R Englund / Carlos Errando Herranz / Eric Bersin
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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Distributed Sensor Array Quench Detection Method for Superconducting Devices

Technology / Case number: #22766
Makoto Takayasu
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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Optically-Heralded Entanglement of Superconducting Systems in Quantum Networks

Technology / Case number: #22977
Dirk R Englund / Hamza Raniwala / Stefan Krastanov
Technology Areas: Computer Science / Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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Contact-Independent and High-Resistance Measurement of Electrical Conductance of a Thin Solid Film with a Nanoscale Sensor

Technology / Case number: #14921
Marc A Kastner / Nirat Ray / Kenneth MacLean / Tamar Mentzel
Technology Areas: Chemicals & Materials / Sensing & Imaging
Impact Areas: Advanced Materials
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Wireless Interlaminar Sensor (WINS): CNT Delamination Sensor with Environmental Compensation

Technology / Case number: #23855J
Brian L Wardle / Haim Primo / Haozhe Wang / Yosef (Yosi) Stein / Luiz Henrique Acauan
Technology Areas: Chemicals & Materials / Communication Systems / Sensing & Imaging
Impact Areas: Advanced Materials
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Pupil Engineering Method to Enhance the Signal of the Real-time non-invasive Particle Size Distribution Probe in Powders and During Mixing, Drying, Blending, and Milling Processes

Technology / Case number: #24521
George Barbastathis / Ajinkya Pandit / Zhen Guo / Qihang Zhang / Richard D Braatz / Allan S. Myerson
Technology Areas: Chemicals & Materials / Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Advanced Materials
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High-Temperature Miniature Ultrasonic Probes

Technology / Case number: #24612
Hoagy O'Ghaffari / Matej Pec
Technology Areas: Sensing & Imaging
Impact Areas: Advanced Materials
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Ultrastrong Magnetic Field Concentration using Magnetic Flux Squeezing in Superconductors

Technology / Case number: #21379
Dirk R Englund / Hyeongrak Choi
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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Electrically Driven Light-Emitting Tunnel Junctions

Technology / Case number: #18393
Jeffrey Lang / Thomas Mahony / Farnaz Niroui / Vladimir Bulovic
Technology Areas: Communication Systems / Sensing & Imaging
Impact Areas: Advanced Materials
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Scintillator for Imaging Terahertz Light

Technology / Case number: #17711
Keith A Nelson / Nathaniel Brandt / Brandt Pein / Wendi Chang / Harold Hwang / Vladimir Bulovic
Technology Areas: Computer Science / Sensing & Imaging
Impact Areas: Sustainable Future, Advanced Materials
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The technologies listed represent a selection of the MIT intellectual property protected by the TLO.

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