Miniaturized 3DIC Integrated Package

Technology / Case number: #17313L
Chenson Chen / Donna-Ruth Yost / Rabindra Das / Steven Vitale / Keith Warner / Mark Gouker / Craig Keast
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

High-Frequency, High Density PFC Power Conversion

Technology / Case number: #17250
David Otten / Juan Santiago-Gonzalez / Khurram Afridi / David J Perreault
Technology Areas: Electronics & Photonics / Energy & Distribution
Impact Areas: Connected World
License

Printed Circuit Board with Rohacell Hybrid Via Process

Technology / Case number: #17133L
Glenn Brigham
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

Precision 3D-Integrated Circuit Wafer-to-Wafer Alignment and Bonding

Technology / Case number: #17076L
Keith Warner / Richard D'Onofrio / Donna-Ruth Yost
Technology Areas: Chemicals & Materials / Electronics & Photonics / Industrial Engineering & Automation
Impact Areas: Advanced Materials
License

Electrically Conducting Two-Dimensional Materials With Metal-Ortho-Phenylenediimine Units

Technology, Tangible Property / Case number: #16971
Mircea Dinca / Michael Campbell / Lei Sun / Dennis Sheberla / Casey Wade
Technology Areas: Chemicals & Materials / Electronics & Photonics / Energy & Distribution
Impact Areas: Connected World
License

Air Dielectric Laminate Process for Printed Circuit Boards

Technology / Case number: #16958L
Glenn Brigham
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

Methods, Materials and Systems for Voltage Programming Material Properties

Technology / Case number: #16957
Geoffrey Stephen Beach / Uwe Bauer
Technology Areas: Chemicals & Materials / Electronics & Photonics / Energy & Distribution
Impact Areas: Advanced Materials
License

Design Interconnects for Finer Pitch Assembly Suitable for Commercial and Military Applications

Technology / Case number: #16918L
Mark Gouker / Michael Barbieri / Noyan Kinayman / Karen Harmon / Peter Murphy / Rabindra Das / Timothy Hancock
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

Space-Time Modulated Active 3D Imager-on-Chip

Technology / Case number: #16889L
Nicholas Armstrong-Crews / Bryce Remesch
Technology Areas: Communication Systems / Electronics & Photonics
Impact Areas: Connected World, Advanced Materials
License

Improved Performance and Stability in Quantum Dot Solar Cells through Band Alignment Engineering

Technology / Case number: #16759
Moungi G Bawendi / Patrick Brown / Chia-Hao Chuang / Vladimir Bulovic
Technology Areas: Electronics & Photonics / Energy & Distribution
Impact Areas: Climate Stabilization
License
Subscribe to Semiconductors