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Quantum Register with Entangled Fermions

Technology / Case number: #22431
Martin Zwierlein / Botond Oreg / Ningyuan Jia / Thomas Hartke
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
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Elastic Strain Engineering of Diamond Bandgap and Diamond Metallization

Technology / Case number: #22724J
Subra Suresh / Zhe Shi / Ju Li / Ming Dao
Technology Areas: Computer Science / Electronics & Photonics / Industrial Engineering & Automation
Impact Areas: Sustainable Future, Advanced Materials
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NetCast: Low-Power Edge Computing with Optical Neural Networks via WDM Weight Broadcasting

Technology / Case number: #22737J
Dirk R Englund / Ryan Hamerly
Technology Areas: Biotechnology / Computer Science / Sensing & Imaging
Impact Areas: Healthy Living
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Distributed Sensor Array Quench Detection Method for Superconducting Devices

Technology / Case number: #22766
Makoto Takayasu
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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Optically-Heralded Entanglement of Superconducting Systems in Quantum Networks

Technology / Case number: #22977
Dirk R Englund / Hamza Raniwala / Stefan Krastanov
Technology Areas: Computer Science / Electronics & Photonics / Sensing & Imaging
Impact Areas: Advanced Materials
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Room-Temperature Coherent Spin-Photon Interface

Technology / Case number: #23010
Dirk R Englund / Hanfeng Wang / Hamza Raniwala / Stefan Krastanov / Laura Kim / Matthew Trusheim
Technology Areas: Electronics & Photonics
Impact Areas: Advanced Materials
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Field Management Structures for Vertical GaN Power Devices

Technology / Case number: #23037
Tomas Palacios / John Niroula / Ahmad Zubair
Technology Areas: Electronics & Photonics / Industrial Engineering & Automation
Impact Areas: Advanced Materials
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Error Correction for Programmable Photonics

Technology / Case number: #23048
Dirk R Englund / Saumil Bandyopadhyay / Ryan Hamerly
Technology Areas: Computer Science / Electronics & Photonics
Impact Areas: Connected World, Advanced Materials
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TSV Qubit

Technology / Case number: #22218L
Jamie Kerman / Thomas Hazard / Justin Mallek / Cyrus Hirjibehedin / Mollie Schwartz / Wayne Woods / Jonilyn Yoder / Danna Rosenberg / Donna-Ruth Yost / William Oliver
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Computer Science / Electronics & Photonics
Impact Areas: Advanced Materials
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Integrated Optical Field Sampling Platform

Technology / Case number: #22691J
Franz Kaertner / Felix Ritzkowsky / Dario Cattozzo Mor / Phillip Donald Keathley / Mina Bionta / Marco Turchetti / Yujia Yang / William Putnam / Karl Berggren
Technology Areas: Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Connected World
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Strain-engineered Artificial Atom as a Broad-spectrum Solar Energy Funnel

Technology / Case number: #15741J
Ju Li / Xiaofeng Qian / Ji Feng
Technology Areas: Communication Systems / Electronics & Photonics
Impact Areas: Connected World
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Cyclotron Phase-Lock Loop Control

Technology / Case number: #15762
Leslie Bromberg / Peisi Le / Philip Michael / Timothy Antaya / Joseph V. Minervini / Alexey Radovinsky
Technology Areas: Electronics & Photonics
Impact Areas: Advanced Materials
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Closed-Loop Ingestible Robot for Radiation and Chemical Sensing

Technology / Case number: #22735
Giovanni Traverso / James Byrne / Hen Wei Huang
Technology Areas: Biomaterials & Bioelectronics / Biotechnology / Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Healthy Living, Uncharted Frontiers
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Contact-Independent and High-Resistance Measurement of Electrical Conductance of a Thin Solid Film with a Nanoscale Sensor

Technology / Case number: #14921
Marc A Kastner / Nirat Ray / Kenneth MacLean / Tamar Mentzel
Technology Areas: Chemicals & Materials / Sensing & Imaging
Impact Areas: Advanced Materials
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Wireless Interlaminar Sensor (WINS): CNT Delamination Sensor with Environmental Compensation

Technology / Case number: #23855J
Brian L Wardle / Haim Primo / Haozhe Wang / Yosef (Yosi) Stein / Luiz Henrique Acauan
Technology Areas: Chemicals & Materials / Communication Systems / Sensing & Imaging
Impact Areas: Advanced Materials
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Pupil Engineering Method to Enhance the Signal of the Real-time non-invasive Particle Size Distribution Probe in Powders and During Mixing, Drying, Blending, and Milling Processes

Technology / Case number: #24521
George Barbastathis / Ajinkya Pandit / Zhen Guo / Qihang Zhang / Richard D Braatz / Allan S. Myerson
Technology Areas: Chemicals & Materials / Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Advanced Materials
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Low-Temperature Synthesis of Two-Dimensional Materials

Technology / Case number: #24560
Jing Kong / Ji Hoon Park / Jiadi Zhu / Jiangtao Wang / Tomas Palacios
Technology Areas: Chemicals & Materials / Electronics & Photonics / Energy & Distribution / Industrial Engineering & Automation
Impact Areas: Advanced Materials
License

High-Temperature Miniature Ultrasonic Probes

Technology / Case number: #24612
Hoagy O'Ghaffari / Matej Pec
Technology Areas: Sensing & Imaging
Impact Areas: Advanced Materials
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Method of Forming Topcoat for Patterning

Technology / Case number: #18405QJ
Karen Gleason / Hyo Seon Suh / Paul Nealey / Do Han Kim / Priya Moni
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
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Device and Method for Imaging Shortwave Infrared Autofluorescence

Technology / Case number: #18527J
Moungi G Bawendi / Marianne Aellen / Yi Zheng / Klaus Van Leyen / Jessica Carr / Oliver Bruns
Technology Areas: Diagnostics / Sensing & Imaging
Impact Areas: Healthy Living
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The technologies listed represent a selection of the MIT intellectual property protected by the TLO.

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