Mark Gouker

Assistant Division Head, Lincoln Lab
Department
Lincoln Laboratory
Technology Areas
Electronics & Photonics: Semiconductors / Computer Science: Quantum Computing / Chemicals & Materials: Nanotechnology & Nanomaterials
Impact Areas
Connected World, Advanced Materials

Technologies

Design Interconnects for Finer Pitch Assembly Suitable for Commercial and Military Applications

Technology / Case number: #16918L
Mark Gouker / Michael Barbieri / Noyan Kinayman / Karen Harmon / Peter Murphy / Rabindra Das / Timothy Hancock
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

Miniaturized 3DIC Integrated Package

Technology / Case number: #17313L
Chenson Chen / Donna-Ruth Yost / Rabindra Das / Steven Vitale / Keith Warner / Mark Gouker / Craig Keast
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

Structures, Compositions and Fabrications of Microbump Based Interconnect Technology for High Density Packaging

Technology / Case number: #17465L
Leonard Johnson / Ryan Johnson / Rabindra Das / Pascale Gouker / Mark Gouker
Technology Areas: Electronics & Photonics
Impact Areas: Connected World, Advanced Materials
License

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