Mark Gouker

Assistant Division Head, Lincoln Lab
Department
Lincoln Laboratory
Technology Areas
Electronics & Photonics: Semiconductors / Computer Science: Quantum Computing / Chemicals & Materials: Nanotechnology & Nanomaterials
Impact Areas
Connected World, Advanced Materials

Technologies

Design Interconnects for Finer Pitch Assembly Suitable for Commercial and Military Applications

Technology / Case number: #16918L
Timothy Hancock / Rabindra Das / Peter Murphy / Karen Harmon / Noyan Kinayman / Michael Barbieri / Mark Gouker
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

Miniaturized 3DIC Integrated Package

Technology / Case number: #17313L
Steven Vitale / Rabindra Das / Donna-Ruth Yost / Chenson Chen / Craig Keast / Mark Gouker / Keith Warner
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

Structures, Compositions and Fabrications of Microbump Based Interconnect Technology for High Density Packaging

Technology / Case number: #17465L
Leonard Johnson / Pascale Gouker / Rabindra Das / Ryan Johnson / Mark Gouker
Technology Areas: Electronics & Photonics
Impact Areas: Connected World, Advanced Materials
License

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