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Spiral Integrated Optical Phased Arrays for Tunable Near-Field-Focusing Emission

Technology / Case number: #26247
Jelena Notaros
Technology Areas: Computer Science / Electronics & Photonics / Sensing & Imaging
Impact Areas: Connected World
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Exponential Stacking of Hybrid Metal-Elastomer Nanomembranes for High-Performance Stretchable Electronics

Technology / Case number: #26474
Polina Anikeeva / Camille Cunin / Dongjun Jung / Aristide Gumyusenge
Technology Areas: Chemicals & Materials / Electronics & Photonics / Energy & Distribution
Impact Areas: Connected World, Advanced Materials
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Multicycle THz Generation in Nonlinear Slab Waveguides

Technology / Case number: #26484
Keith A Nelson / Xi Zhang / Nadia Berndt / David Rohrbach
Technology Areas: Chemicals & Materials / Electronics & Photonics / Sensing & Imaging
Impact Areas: Connected World, Advanced Materials
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Thermally-Motivated Circuit Designs and Chip Capabilities

Technology / Case number: #26525L
Chenson Chen / Ryan Keech / Phillip Bailey / Melissa Smith / Daniel Santiago
Technology Areas: Computer Science / Electronics & Photonics / Sensing & Imaging
Impact Areas: Connected World
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Photonic Ribbon Cables

Technology / Case number: #26146J
Dirk R Englund / Matthew Saha / Andrew Leenheer
Technology Areas: Communication Systems / Computer Science / Electronics & Photonics
Impact Areas: Connected World
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Chiral Quantum Interconnect with Microwave Photons

Technology / Case number: #26213
William Oliver / Beatriz Yankelevich / Aziza Almanakly / Jeffrey Grover / Bharath Kannan
Technology Areas: Computer Science / Electronics & Photonics
Impact Areas: Connected World
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Isolated Piezoelectric-Resonator-Based Converter and Devices

Technology / Case number: #26405
Jeffrey Lang / Daniel Brown / Amanda Jackson / David J Perreault
Technology Areas: Electronics & Photonics / Energy & Distribution / Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Sustainable Future, Connected World, Advanced Materials
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Non-Degenerate Noise-Resilient Superconducting Qubit

Technology / Case number: #25899
William Oliver / Max Hays / Junghyun Kim
Technology Areas: Chemicals & Materials / Computer Science / Electronics & Photonics
Impact Areas: Connected World, Advanced Materials
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Uncooled Far-Infrared (IR) Imaging based on Ultrathin Freestanding Single-Crystalline Oxide Membrane and Interface Engineering Thereof

Technology / Case number: #25693
Jeehwan Kim / Xinyuan Zhang / Chang-Beom Eom
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Connected World
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Operational Amplifier based Modified Armstrong Oscillator (OAMAO)

Technology / Case number: #25698J
Brian L Wardle / Aniruddha Ghosh / Haim Primo / Yosef (Yosi) Stein / Luiz Henrique Acauan
Technology Areas: Electronics & Photonics / Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Connected World
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Bosonic Computing with Integrated Nano Mechanical Resonators and Solid State Spins

Technology / Case number: #26527
Dirk R Englund / Ethan G Arnault / Hamza Raniwala / Matthew Trusheim
Technology Areas: Chemicals & Materials / Computer Science / Electronics & Photonics
Impact Areas: Connected World
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Sub-13.5 nm Projection Lithography System and Components

Technology / Case number: #26289L
Mordechai Rothschild / Paul Chesler / Nate O'Connor / Peter Moulton / Tommy Sebastian / Vladimir Liberman
Technology Areas: Chemicals & Materials / Electronics & Photonics / Industrial Engineering & Automation
Impact Areas: Connected World, Advanced Materials
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Optical Neural Network Accelerator for Deep Learning

Technology / Case number: #26433J
Dirk R Englund / Chao Luan / Ryan Hamerly
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Computer Science / Electronics & Photonics
Impact Areas: Connected World
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Channel Scalable, Coherent Beam Combined Laser Architecture

Technology / Case number: #25507L
Tso Yee Fan / Kan Thach / Luis Ortega / Louis Isabella / Kelsey Johnsen / Yin Wan Tam / John Kim / Niyom Lue
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Connected World, Advanced Materials
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Embedded Hard-Stop Interconnect Spacers for 3D/Flip-Chip Integrated Superconducting Qubit Module

Technology / Case number: #26145L
William Oliver / Bethany Huffman / David Kim / Mollie Schwartz / Jonilyn Yoder / Rabindra Das
Technology Areas: Chemicals & Materials / Electronics & Photonics / Industrial Engineering & Automation
Impact Areas: Connected World
License

Cavity-Enhanced Solid-State Nuclear Spin Gyroscope

Technology / Case number: #26298
Dirk R Englund / Hanfeng Wang / Matthew Trusheim
Technology Areas: Electronics & Photonics / Energy & Distribution / Sensing & Imaging
Impact Areas: Connected World
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Systems, Devices, and Methods Utilizing Hybrid Photonic Crystal Cavities

Technology / Case number: #26325J
Dirk R Englund / Andy Greenspon / Mark Dong
Technology Areas: Computer Science / Electronics & Photonics / Energy & Distribution
Impact Areas: Connected World
License

Multi-Waveguide Beam Scanners and Scanning Pattern Methods

Technology / Case number: #26324J
Dirk R Englund / Matthew Zimmermann / Henry Wen
Technology Areas: Biotechnology / Electronics & Photonics / Energy & Distribution / Industrial Engineering & Automation
Impact Areas: Sustainable Future, Connected World
License

Transistor Structure and Method of Forming the Same

Technology / Case number: #25279
Tomas Palacios / Gillian Micale / Pao-Chuan Shih / John Niroula / Qingyun Xie
Technology Areas: Chemicals & Materials / Electronics & Photonics / Energy & Distribution
Impact Areas: Connected World
License

A MEMS Based Encapsulated Hydrophone

Technology / Case number: #26013LJ
Daniel Freeman / James Vlahakis / Georgios Karamanis / Jonathan Anderson / Robert White
Technology Areas: Chemicals & Materials / Electronics & Photonics / Industrial Engineering & Automation / Sensing & Imaging
Impact Areas: Sustainable Future, Connected World
License

The technologies listed represent a selection of the MIT intellectual property protected by the TLO.

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