Toroidal Bending Magnets for Hadron Therapy Gantries

Technology / Case number: #17367
Leslie Bromberg / Philip Michael
Technology Areas: Electronics & Photonics / Industrial Engineering & Automation
Impact Areas: Advanced Materials
License

Liquid Crystal Alignment Layer

Technology / Case number: #17358LJ
Carl Bozler / Douglas Bryant / Philip Bos / Valerie Finnemeyer / Shaun Berry / Robert Reich / Harry Clark
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Connected World
License

Photon-Timing Detector Array with Embedded Processor

Technology / Case number: #17316L
Dale Fried / Jonathan Frechette
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Connected World
License

Miniaturized 3DIC Integrated Package

Technology / Case number: #17313L
Chenson Chen / Donna-Ruth Yost / Rabindra Das / Steven Vitale / Keith Warner / Mark Gouker / Craig Keast
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

High-Frequency, High Density PFC Power Conversion

Technology / Case number: #17250
David Otten / Juan Santiago-Gonzalez / Khurram Afridi / David J Perreault
Technology Areas: Electronics & Photonics / Energy & Distribution
Impact Areas: Connected World
License

Fiber-Based Laser Frequency Stabilization by Polarization Spectroscopy

Technology / Case number: #17191
Matthew J Evans / Nicolas Brown / Aaron Buikema / Adam Libson
Technology Areas: Communication Systems / Electronics & Photonics
Impact Areas: Connected World
License

New Structures for GaN Vertical Transistors

Exclusively Licensed Technology / Case number: #17168
Tomas Palacios / Min Sun
Technology Areas: Chemicals & Materials / Electronics & Photonics / Energy & Distribution
Impact Areas: Advanced Materials

Compact FOV Multiplexing Telescope

Technology / Case number: #17160L
Yaron Rachlin / R. Hamilton Shepard
Technology Areas: Electronics & Photonics / Sensing & Imaging
Impact Areas: Connected World
License

Printed Circuit Board with Rohacell Hybrid Via Process

Technology / Case number: #17133L
Glenn Brigham
Technology Areas: Chemicals & Materials / Electronics & Photonics
Impact Areas: Advanced Materials
License

Precision 3D-Integrated Circuit Wafer-to-Wafer Alignment and Bonding

Technology / Case number: #17076L
Keith Warner / Richard D'Onofrio / Donna-Ruth Yost
Technology Areas: Chemicals & Materials / Electronics & Photonics / Industrial Engineering & Automation
Impact Areas: Advanced Materials
License
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