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End-to-End Deep Learning Approach to Predict Complex Stress and Strain Fields Directly from Microstructural Images

Technology / Case number: #22477
Markus Buehler / Chi Hua Yu / Zhenze Yang
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Computer Science / Electronics & Photonics
Impact Areas: Advanced Materials
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Making Screens Safe for those with Photosensitivity

Technology / Case number: #20349
Andrei Barbu / Dalitso Banda / Boris Katz
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Computer Science
Impact Areas: Healthy Living, Uncharted Frontiers, Connected World
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The technologies listed represent a selection of the MIT intellectual property protected by the TLO.

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