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Systems and Methods for Computational Discovery of Microstructured Composites with Optimized Trade-off between Strength and Toughness

Technology / Case number: #23354
Wojciech Matusik / Wan Shou / Beichen Li
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Chemicals & Materials / Industrial Engineering & Automation
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Machine Learning for the Discovery of Nanomaterial-based Molecular Recognition

Technology / Case number: #23691
Michael Strano / Retsef Levi / Xun Gong / Nicholas Renegar
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Biotechnology / Chemicals & Materials / Sensing & Imaging
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All-Optical Holographic Implementation of Constant-Depth Quantum Circuits

Technology / Case number: #21655
Dirk Englund / Donggyu Kim
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Computer Science / Sensing & Imaging
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Joint Qubit Manipulation and Readout for Majorana-Based Quantum Information Processing

Technology / Case number: #20208
Liang Fu / Constantin Schrade
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Chemicals & Materials / Computer Science / Electronics & Photonics
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Machine-Vision Guided Microscopy for Autonomous Characterization of Quantum Emitters and Photonic Nanostructures

Technology / Case number: #19312
Dirk Englund / Michael Walsh
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Biotechnology / Electronics & Photonics
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Method for Identifying Noise Sources in Quantum Systems via Multi-Level Noise Spectroscopy

Technology / Case number: #21722
William Oliver / Youngkyu Sung / Antti Pekka Vepsalainen / Jochen Braumueller / Simon Gustavsson
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Computer Science / Sensing & Imaging
Impact Areas: Advanced Materials
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Printable Programmable Viscoelastic Materials

Technology / Case number: #18624
Daniela Rus / Robert MacCurdy / Jeffrey Lipton
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Industrial Engineering & Automation
Impact Areas: Advanced Materials
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End-to-End Deep Learning Approach to Predict Complex Stress and Strain Fields Directly from Microstructural Images

Technology / Case number: #22477
Markus Buehler / Chi Hua Yu / Zhenze Yang
Technology Areas: Artificial Intelligence (AI) and Machine Learning (ML) / Computer Science / Electronics & Photonics
Impact Areas: Advanced Materials
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The technologies listed represent a selection of the MIT intellectual property protected by the TLO.

filtered: 28 results

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