New Add-on Device for In Situ Laser Shot Peening during Selective Laser Melting

Systems, devices, and methods for improved manufacturing of parts are disclosed. One or more devices realize in situ laser shock peening for selective laser melting process to allow for microstructural control of a manufactured part, both locally and globally. The device can include a platform, an energy source (e.g., a laser), an applier to provide one or more opaque materials to form an opaque overlay, and one or more transparent materials that is/are disposed above the deposited opaque material to form a transparent overlay. The platform can include at least a first conduit used with generating a shock wave as part of the peening process and a second conduit to receive a vacuum device for residue collection from the peening process. The platform can be configured to translate relative to the sample on which the peening process is performed such that printing, peening and vacuuming can be performed substantially simultaneously.