Low Cost, High Performance Optoelectronic Connectors for Integrated Circuit Packaging

Die-to-die electrical interconnects, optical couplers, and related methods for electronic and photonic co-packaging are described. Optical couplers include multi-segmented tapered waveguide core segments, slotted core segments, and graded refractive index structures to significantly relax alignment tolerances between dies. Conductive nanopillars, conductive pads, and conductive micropillars can be used to make electrical connections between circuitry on the inter­connected dies. The electrical connections can be used to self-align the optical couplers between the dies. Due to relaxed optical alignment tolerances, electrical interconnects and optical coupling between dies can be made in the same die-to-die bonding step.