Flip Chip Simultaneous Electrical and Optical Connections
Invention type: Technology
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Case number: #21862
Researchers
Juejun Hu
/ Derek Kita
/ Drew Weninger
/ SamuelFelipe Serna Otalvaro
/ Lionel Kimerling
/ Jurgen Michel
/ Anuradha Agarwal
/ Kazumi Wada
Departments: Department of Materials Science and Engineering, Materials Science and Eng, Materials Research Laboratory
Technology Areas: Chemicals & Materials: Nanotechnology & Nanomaterials / Electronics & Photonics: Photonics
Impact Areas: Advanced Materials
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simultaneous electrical and optical connections for flip chip assembly
United States of America | Granted | 11,067,754 -
simultaneous electrical and optical connections for flip chip assembly
Patent Cooperation Treaty | Published application
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