Scalable and High throughput Assembly of Layer-by-Layer Nanoparticles
Invention type: Technology
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Case number: #25554
Researchers
Ezra Gordon
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Paula Hammond
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Darrell J Irvine
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Ivan Pires
Departments: School of Engineering
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scalable and high throughput assembly of layer-by-layer nanoparticles
Patent Cooperation Treaty | Published application
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