Processes, Systems and Devices for Metal-Filling of Spiral-Grooved, Non-Insulated Superconducting Magnets or Other Open HTS Channels

Described are concepts, systems, structures and techniques for metal filling an open channel in a baseplate. In embodiments, metal filling of an open baseplate channel is achieved using vacuum pressure impregnation. In embodiments, a compression plate is disposed over an open baseplate channel to be filled with a molten metal. In embodiments, gaskets (97) are disposed between the compression plate and a surface of the baseplate proximate the baseplate channel. In embodiments, a channel cap is disposed over the open channel. In embodiments, the channel cap has a solder flow channel provided in a surface thereof. In the embodiments, the solder flow channel has a meandering shape. In embodiments, a solder flow channel is provided in the compression plate and/or the baseplate.