New Technology to Produce Sharp Edges in Metals

Exclusively Licensed

The present disclosure is directed to systems, compositions, and methods for manufacturing objects with sharp edges having a high strength and hardness. To form the sharp edge, an object can be subjected to a compressive force that locally deforms the object to create the sharp edge. In some embodiments, deformation can occur by passing the material through a system of one or more opposed tapered rolls having one or more tapering angles for deforming the material. The tapered rolls can rotate and drive the material downstream to a next opposed pair of tapered rolls. The tapered rolls deform the material by changing the material microstructure, compressing the grains of the material in a predetermined location to create a more homogeneous microstructure. The local modification of the resulting microstructure increases the homogeneity as well as the hardness and strength of the material and prevents cracking and/or chipping of the material.

Researchers

C. Cem Tasan / Gianluca Roscioli

Departments: Office of the Vice President for Research
Technology Areas: Chemicals & Materials: Metals / Industrial Engineering & Automation: Manufacturing & Equipment
Impact Areas: Advanced Materials

  • systems, compositions, and methods for producing sharp edges
    Japan | Pending
  • systems, compositions, and methods for producing sharp edges
    Canada | Published application
  • systems, compositions, and methods for producing sharp edges
    China | Granted | 0
  • systems, compositions, and methods for producing sharp edges
    European Patent Convention | Published application
  • systems, compositions, and methods for producing sharp edges
    Japan | Published application
  • systems, compositions, and methods for producing sharp edges
    India | Published application
  • systems, compositions, and methods for producing sharp edges
    United States of America | Published application
  • systems, compositions, and methods for producing sharp edges
    Hong Kong | Published application

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