Multi-Conductor Demountable Solder Joints for Non-Insulated Superconducting Magnets
Exclusively Licensed
Invention type: Technology
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Case number: #22242
Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections at multiple locations between no insulation (NI) superconductors and in particular between NI high temperature superconductors (HTS) such as may be used in NI-HTS magnets.
Researchers
Brian Labombard
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William Beck
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Theodore Mouratidis
Departments: Plasma Science and Fusion Center
Technology Areas: Chemicals & Materials: Metals / Electronics & Photonics: Semiconductors / Energy & Distribution: Electrochemical Devices / Industrial Engineering & Automation: Manufacturing & Equipment
Impact Areas: Sustainable Future, Advanced Materials
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demountable solder joints for coupling superconducting current paths
United States of America | Granted | 12,243,682 -
demountable solder joints for coupling superconducting current paths
United Kingdom | Published application -
demountable solder joints for coupling superconducting current paths
European Unitary Patent | Published application -
demountable solder joints for coupling superconducting current paths
United States of America | Pending -
demountable solder joints for coupling superconducting current paths
European Patent Convention | Published application -
demountable solder joints for coupling superconducting current paths
Japan | Published application
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