Methods for CMOS Integration with Reduced Thermal Budget
Invention type: Technology
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Case number: #24872L
Researchers
Caroline Ross
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Khoi Dao
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Jia XuBrian Sia
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Kensuke Hayashi
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Cosmin-Constantin Popescu
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Luigi Ranno
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Qingyang Du
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Tian Gu
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Steven Vitale
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Juejun Hu
Departments: Department of Materials Science and Engineering, Materials Science and Eng, Materials Research Laboratory, Lincoln Laboratory
Technology Areas: Electronics & Photonics: Photonics / Industrial Engineering & Automation: Manufacturing & Equipment
Impact Areas: Advanced Materials
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heterogenous photonic integration
United States of America | Pending
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