Methods for CMOS Integration with Reduced Thermal Budget
Invention type: Technology
/
Case number: #24872L
Researchers
Caroline Ross
/
Khoi Dao
/
Jia XuBrian Sia
/
Kensuke Hayashi
/
Cosmin Popescu
/
Luigi Ranno
/
Qingyang Du
/
Tian Gu
/
Steven Vitale
/
Juejun Hu
Departments: Department of Materials Science and Engineering, Materials Science and Eng, Materials Research Laboratory, Lincoln Laboratory
Technology Areas: Electronics & Photonics: Photonics / Industrial Engineering & Automation: Manufacturing & Equipment
Impact Areas: Advanced Materials
-
heterogenous photonic integration
Patent Cooperation Treaty | Published application
License this technology
Interested in this technology? Connect with our experienced licensing team to initiate the process.
Sign up for technology updates
Sign up now to receive the latest updates on cutting-edge technologies and innovations.