Methods for CMOS Integration with Reduced Thermal Budget

Invention type: Technology / Case number: #24872L
License tlo.mit.edu/contact-us

Researchers

Juejun Hu / Steven Vitale / Tian Gu / Qingyang Du / Luigi Ranno / Cosmin Popescu / Kensuke Hayashi / Jia XuBrian Sia / Khoi Dao / Caroline Ross

Departments: Department of Materials Science and Engineering, Lincoln Laboratory, Materials Research Laboratory, Materials Science and Eng
Technology Areas: Electronics & Photonics: Photonics / Industrial Engineering & Automation: Manufacturing & Equipment
Impact Areas: Advanced Materials

  • heterogenous photonic integration
    Patent Cooperation Treaty | Pending

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