Lift-Off Embedded Micro and Nanostructures
Exclusively Licensed
Invention type: Technology
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Case number: #19045
A method includes encapsulating structures disposed on or over a surface of a substrate in an encapsulant. The method also includes separating the encapsulant from the substrate. An apparatus includes a composite film having structures embedded in an encapsulant. The composite film has a surface with a surface roughness of less than one nm. An apparatus includes an encapsulant film having a surface with indentations formed therein. The surface has a surface roughness apart from the indentations of less than one nm.
Researchers
Departments: Dept of Electrical Engineering & Computer Science, Office of the Vice President for Research
Technology Areas: Chemicals & Materials: Composites, Nanotechnology & Nanomaterials / Electronics & Photonics: Photonics, Semiconductors / Industrial Engineering & Automation: Manufacturing & Equipment
Impact Areas: Advanced Materials
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lift-off embedded micro and nanostructures
United States of America | Granted | 11,152,227
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