Layer-Resolved 2D Material Splitting Process and Monolayer 2D Material Wafer Production
Invention type: Technology
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Case number: #19966
Embodiments of this disclosure include apparatus, systems, and methods for fabricating monolayers. In one example, a method includes forming a multilayer film having a plurality of monolayers of a two-dimensional (2D) material on a growth substrate. The multilayer film has a first side proximate the growth substrate and a second side opposite the first side.
Researchers
Jeehwan Kim
/ Wei Kong
/ Jaewoo Shim
Departments: Department of Mechanical Engineering
Technology Areas: Chemicals & Materials: Metals, Nanotechnology & Nanomaterials / Industrial Engineering & Automation: Manufacturing & Equipment
Impact Areas: Advanced Materials
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atomic precision control of wafer-scale two-dimensional materials
United States of America | Granted | 11,355,393
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