High-Temperature Miniature Ultrasonic Probes

The present disclosure is directed to miniature high-temperature ultrasound probes. A device comprising a high temperature piezo-element is disclosed, which is encapsulated within highly anti-oxidizing and non-corrosive electrodes and has been tested within a high temperature- high pressure system to check the performance of the device. Although the disclosed embodiments are suitable for use in a high temperature ultrasound transducer array, the detailed high temperature-design disclosed herein is not limited to monitoring acoustic emissions and conducting active probes (phase arrival) but can be employed also as pressure (load) sensors if the sensor is characterized and calibrated for a working load and temperature interval.