Process for Creating Novel Monolithic Circuits with New Materials
Exclusively Licensed
Invention type: Technology
/
Case number: #15536
A method includes attaching a partially processed CMOS wafer to a second wafer to produce a combined wafer. The second wafer comprises a first region including a material different from silicon. The method also includes forming devices in the first region or in a second region of the combined wafer having a material different from silicon.
Researchers
Departments: Department of Materials Science and Engineering
Technology Areas: Chemicals & Materials: Composites, Nanotechnology & Nanomaterials / Electronics & Photonics: Semiconductors / Industrial Engineering & Automation: Manufacturing & Equipment
Impact Areas: Connected World, Advanced Materials
-
monolithic integration of cmos and non-silicon devices
United Kingdom | Granted | 2,834,850 -
monolithic integration of cmos and non-silicon devices
Korea (south) | Granted | 10 -
monolithic integration of cmos and non-silicon devices
United States of America | Granted | 9,530,763 -
monolithic integration of cmos and non-silicon devices
European Patent Convention | Granted | 2,834,850 -
monolithic integration of cmos and non-silicon devices
Japan | Granted | 6,060,252 -
monolithic integration of cmos and non-silicon devices
Germany | Granted | 2,834,850 -
monolithic integration of cmos and non-silicon devices
France | Granted | 2,834,850
License this technology
Interested in this technology? Connect with our experienced licensing team to initiate the process.
Sign up for technology updates
Sign up now to receive the latest updates on cutting-edge technologies and innovations.