Integration of Thin-Film Electronics into Unconventional Surfaces
Exclusively Licensed
Invention type: Technology
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Case number: #23163
A device, comprising: a flexible carrier; a release layer that is formed on the flexible carrier; a releasable substrate formed over the release layer; and a semiconductor structure that is formed over the releasable substrate.
Researchers
Vladimir Bulovic
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Jeremiah Mwaura
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Mayuran Saravanapavanantham
Departments: Office of the Vice President for Research
Technology Areas: Chemicals & Materials: Composites / Electronics & Photonics: Semiconductors / Industrial Engineering & Automation: Manufacturing & Equipment
Impact Areas: Connected World, Advanced Materials
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solution processable ultra-thin substrates for opto-electronic device applications
European Patent Convention | Pending -
transferable ultra-thin substrates and related techniques
United States of America | Granted | 11,935,977 -
solution processable ultra-thin substrates and related techniques
United States of America | Pending -
solution processable ultra-thin substrates for opto-electronic device applications
China | Published application
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