The novel method for bonding COC materials to glass, PMMA, or other COC materials for creating microfluidic devices involves just a thin film of elastomeric material, a metal clamp, an oven, and a refrigerator. First, a coating of the elastomeric material is sandwiched between the two pieces to be bonded, then a clamp is used to hold the layers together before placing the pieces in an oven to slowly heat up to 84°C. Afterwards, the bonded part is rapidly cooled to 4°C and is ready for use. Other methods in this patent describe diaphragm micropumps for complete displacement of fluid and stable flow, quick release tops for easy access to cell culture along with means of incorporating hydrogels for said cell culture, and many other features.