Header and Body 2

Problem Addressed

Current fabrication by chemical vapor deposition on metallic foils is incompatible with polymer or dielectric substrates, thus limiting the applications for this method. Further, other transfer methods rely on wet chemistry or adhesives that can result in defects, unintentional doping, and wasted growth substrate. This transfer process also addresses the need for scalability in size and manufacturing speed, further facilitating research in the effective transfer printing of 2D materials.