Header and Body 3


The 3D printing technology presented herein comprises a conductive ink and a method to use the ink for electronic prototyping. The inks are composed of conductive particles, triblock copolymers, and a volatile solvent.  This modular system yields printed materials with tailorable conductive properties through appropriate choice of solvent and ratio of conductive particles to triblock copolymers.

The additive manufacturing method developed for this technology uses a solvent cast 3D printing process. Layers of the conductive ink are applied to a substrate, creating micro- interconnect structures. The solvent in the ink evaporates after extrusion, leaving the conductive interconnect structures and eliminating the need for high-temperature sintering. Once dry, the printed component can be integrated into any electronic system, such as a radio frequency (RF) device or a biocompatible medical device.