Header and Body 3

Technology:

A single-chip spin-control/detection system using standard CMOS processes is implemented to address the problem of scalability. Through a tightly-integrated microwave launcher, photonic filter, and sensor, the CMOS circuits offer more direct physical interactions with the quantum states, rather than being used as simple electronic I/O modules. This enables ultra-compact and highly scalable platforms for room-temperature quantum sensing and information processing under cryogenic conditions . On-chip CMOS integration decreases the form factor and fabrication costs since the magnetometer system can be made through standard CMOS fabrication processes.