A superconducting computing architecture with a scalable cryogenic 3D integration approach is the solution to these requirements. This approach yields the ability to design computing circuitry to fit the cryogenic space, rather than adjusting the cryogenic space to fit the computer circuits. The cryogenic package includes multiple superconducting multi-chip modules, which connect to each other with room temperature semiconductor components. This structure allows the selection of the best possible, commercially available, superconducting die and components from various suppliers. The 3D design minimizes the use of physical space, and maximizes superconducting paths, to increase processing speeds and decrease signal path resistance.