The low-loss superconducting integrated circuit includes a superconducting resonator device formed with a low stress, polycrystalline titanium nitride layer deposited on highly resistive Si to provide a high quality factor. This material combination creates a low loss resonator structure when operated at radio or microwave frequencies. The superconducting resonator plays a significant role in qubit design, interqubit coupling, quantum information storage, and quantum-state dispersive readout because of its low signal-to-noise ratio and low power dissipation. When cooled to dilution refrigerator temperatures, these superconducting circuits behave as quantum mechanical oscillators which can store quantum bits of information. The superconducting device is made of a substrate layer, and a conductive layer followed by a patterned resistive layer. This patterning forms an opening for the conducting layer to form interconnects with other integrated circuits. The superconducting interconnect structures are also applicable to flip-chip assemblies that enable the combination of multiple qubit die into a single package. This package structure also enables the replacement, repair, and upgrade of each individual qubit die, if necessary.