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Problem Addressed

There is a trend toward miniaturization of electronic products in mobile phones, tablets, and digital cameras. Consequently, there is a trend in semiconductor device manufacturing towards smaller and more densely packed semiconductor structures. This has resulted in a demand for semiconductor packages which are relatively low loss, lightweight structures and which support increased electronic capabilities (e.g., increased density, mobility and extended operational life) in miniaturized electronic products demanded by both military and commercial customers alike. The foregoing trend and demand, drives a need for multi-layer semiconductor devices, semiconductor devices including at least two semiconductor structures. There is consequently, a need for interconnect structures which enable assembly of multi-layer semiconductor devices.