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This technology is a fast, simple and low cost technique for micro-fabricating PCBs with copper traces down to 3 µm in width. This technique involves electrochemical etching, photolithography, and a semi-additive metallization process that is compatible with commercially available PCB substrates. This fabrication technique is rapid, cost-effective and scalable for industrial applications. Additionally, costs can be further reduced by recycling the copper removed in the electro-etching step for later reuse in the electroplating step.