Header and Body 2

Problem Addressed

Printed circuit boards (PCBs) are extremely prevalent across nearly all electronic devices. As increasing demand for miniaturized electronics grows, there is an increasing need to shrink the footprint of printed circuit boards. However, miniaturization of PCBs is currently limited by the minimum trace sizes achievable with established manufacturing techniques and the high costs associated with microfabrication. This technology is a novel PCB fabrication technique that can achieve PCB miniaturization at a fraction of the costs of traditional techniques.