Wearable computing platforms such as health-tracking and head-mounted systems present new challenges to energy-efficient design. The processors in these platforms are connected to many sensor integrated circuits (ICs) and the data transfer between ICs is usually the main focus of the power-reduction efforts. Because the power-efficiency for inter-IC communication is limited by printed circuit board properties, it has not scaled with advantages in semiconductor technology. Efforts to-date at reducing the inter-IC communication cost are targeted toward parallel busses, and not bit-serial communication links that are used in many embedded computing platforms. The Inventors have come up with a VDBS encoding technique that reduce signal transitions and thereby reduce dynamic power dissipation on bit-serial communication interfaces.