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The invention is a method for using a transfer layer material to resolve the low melting point temperature problem involved in fabricating flexible substrates. Electronic and photonic devices are initially fabricated on a transparent transfer material, which is chosen so that the devices can easily be separated from it. Then the devices are removed from the transfer layers and are transferred to the flexible substrate. The invention includes a detailed method for choosing and growing the transfer layer, methods for removing the layer after device fabrication and optimal methods for transfer of the devices to the flexible substrate.