Header and Body 2

Problem Addressed

Electronic and optoelectronic devices are typically fabricated using a variety of elaborate wafer-based processes. These afford dense device packing and small feature sizes, but are restricted to planar geometries with limited coverage area. Preform-based fiber-drawing techniques are, in comparison, simpler and yield extended lengths of highly uniform fibers with well controlled geometries and excellent transport characteristics. However, they are only used with a small number of materials and only large-sized features have been implemented.