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  • Lithography directed assembly has a resolution defined by the thermodynamic properties of the diblock copolymer instead of the chemistry of the resist, thus allowing manipulation to yield sub-10 nm patterning.
  • Approach does not employ traditional resist based lithography to define the pattern, thereby reducing the processing steps and manufacturing costs
  • Approach is possibly the only viable method to produce sub-22 nm based integrated circuits without the use of directed self assembly