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The technology is a low-loss superconducting integrated circuit which exhibits all of the characteristics desired in qubit systems. The invention includes an integrated approach to developing flip-chip superconducting interconnects for 3D constructions on various qubit die package configurations. It is capable of depositing High Q TiN on 8” wafer and is capable of generating High Q from various TiN film thicknesses. This versatile invention has been proven effective on a variety of instrumentation systems, enabling easy integration of heterogeneous technologies and components on the same chip.