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Problem Addressed

Electronic manufacturers currently use Thin-Film Bulk Acoustic Wave Resonators (FBAR) and/or Surface Acoustic Wave (SAW) resonators to manufacture Micro-electro-mechanical systems (MEMS). However, existing MEMS devices require separate manufacturing of the resonator and the circuit-board upon which the resonator is mounted. There are current techniques that allow for the direct integration of MEMS devices with the complementary integrated circuits; however, the resonators still require a release-step in order to create fully suspended moving structures. Not only does this integration technique add complexity to the manufacturing of MEMS devices, but the manufacturing process also reduces circuit performance.