During imprinting of patterns from a stamp onto a substrate surface, conformal contact is necessary to ensure that pattern transfer is successful over the entire stamp. However, such contact is hindered by the initial angular misalignment between the surfaces. In real systems, this misalignment is inevitable and arises due to the two surfaces being non-parallel. Therefore, alignment systems that can orient the surface parallel to each other while bringing them in contact are necessary during imprinting. Current alignment systems are one of two types: (1) active systems that use feedback control; (2) manual techniques that rely on the deformability of a soft stamp. For micro/nano imprinting, active systems are expensive and become a barrier to entry for small businesses and academic laboratories. Manual techniques are inappropriate for imprinting fragile features because micro/nano features on the stamp are squished by conformal contact. Thus, there is a technology gap that can be filled by developing high-performance and low-cost alignment system.