Vacuum fabrication of multilayered devices is not constrained by the requirement of finding orthogonal solvents to prevent mixing between layers during deposition. However, the high temperatures necessary to physically deposit polymers by vacuum thermal evaporation leads to polymer degradation, limiting materials to low-molecular weight organics. oCVD offers the benefits of vacuum processing, including parallel and sequential deposition, well-defined thickness control and uniformity, and inline integration with other standard vacuum processes (e.g. vacuum thermal evaporation). Additionally, oCVD is conformal over nonplanar substrates, enabling compatibility with substrates such as paper and textiles.